Help me improve my dire first attempt at soldering

so, came assemble first shields arduino - first off, soldering stackable headers on adafruit cc3000 wifi shield.

i didn't expect expert first attempts are, have say, poor.  spending tomorrow night trying undo solder wick (i tried desolder pump found impossible).

i'm using hakko fx-888d iron/station 63/37 lead/tin rosin core solder.  2 things can perhaps me with:

- set iron temp 350 celcius (i read guide somewhere).  hot / cold?
- iron came tip t18-b shape-b https://www.hakko.com/english/tip_selection/series_t18.html#type_b found tip difficult use , large compared tiny pins / pads.  tell me if better using different hakko tip range http://www.hakko.com/english/products/hakko_fx888d_tips.html#productnav
- found myself touching solder on iron tip flow ... guess causing me problems?

i appreciate soldering comes practice , lots of guides out there.  maybe advice on above me though.

thanks!

you don't went wrong exactly. problems having?  350°c sounds right.

i'm more familiar weller equipment hakko b-shape appears conical tip, , t18-b has 0.5mm radius, yes that's bit large surface mount or smaller through-hole work typical of tips come on irons factory. prefer screwdriver shape tips, hakko t18-d08 looks identical weller tip use most. tip size bit of double-edged sword, smaller can easier work with, tiny area @ end not hot or able transfer heat.

without more information, wouldn't blame problems on tip. sure keep tip clean. tin tip applying solder directly , wiping in brass-sponge type cleaner. tip should shiny , wet looking, without large amount of solder on it. key getting transfer heat. don't leave iron on long periods if it's not being used causes tip oxidize. turn mine off or @ least down if have pause couple minutes.

keep in mind has hot enough melt solder, meaning pad , wire through-hole components. ideally, apply iron contact both pad , wire, give second heat up, apply solder pad , wire meet. necessary apply solder iron meets work. ok, apply little @ first, give second heat wire , pad, apply more solder finish joint. you'll know when things hot enough because solder flow , fill via.

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